View NCP154MX150280TAG_8231313.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

? semiconductor components industries, llc, 2015 january, 2015 ? rev. 2 1 publication order number: ncp154/d ncp154 dual 300 ma, low i q , low dropout, dual input voltage regulator the ncp154 is 300 ma, dual output linear voltage regulator that offers two independent input pins and provides a very stable and accurate voltage with ultra low noise and very high power supply rejection ratio (psrr) suitable for rf applications. the device doesn?t require any additional noise bypass capacitor to achieve ultra low noise performance. in order to optimize performance for battery operated portable applications, the ncp154 employs the adaptive ground current feature for low ground current consumption during light-load conditions. features ? operating input voltage range: 1.9 v to 5.25 v ? two independent input voltage pins ? two independent output voltage (for detail please refer to ordering information) ? low iq of typ. 55 a per channel ? high psrr: 75 db at 1 khz ? very low dropout: 140 mv typical at 300 ma ? thermal shutdown and current limit protections ? stable with a 1 f ceramic output capacitor ? available in xdfn8 1.2 1.6 mm package ? active output discharge for fast output turn-off ? these are pb-free devices typical applications ? smartphones, tablets ? wireless handsets, wireless lan, bluetooth ? , zigbee ? interfaces ? other battery powered applications in1 in2 en1 en2 out1 out2 gnd ncp154 v out1 v out2 c out1 1 f c out2 1 f c in2 1 f c in1 1 f v in1 v in2 figure 1. typical application schematic xdfn8, 1.2x1.6 case 711as marking diagram http://onsemi.com pin connections 2 4 gnd out1 3 out2 7 5 en2 in1 6 in2 ep 1 gnd 8 en1 see detailed ordering, marking and shipping information in the package dimensions section on page 17 of this data sheet. ordering information xdfn8 (top view) x = specific device code m = date code = pb?free package xm
ncp154 http://onsemi.com 2 figure 2. simplified schematic block diagram in2 out2 active discharge thermal shutdown enable logic gnd en2 en2 bandgap reference mosfet driver with current limit thermal shutdown mosfet driver with current limit active discharge en1 bandgap reference enable logic en1 out1 in1 gnd table 1. pin function description pin no. pin name description 1 gnd power supply ground. soldered to the copper plane allows for effective heat dissipation. 2 out1 regulated output voltage of the first channel. a small 1 f ceramic capacitor is needed from this pin to ground to assure stability. 3 out2 regulated output voltage of the second channel. a small 1 f ceramic capacitor is needed from this pin to ground to assure stability. 4 gnd power supply ground. soldered to the copper plane allows for effective heat dissipation. 5 en2 driving en2 over 0.9 v turns-on out2. driving en below 0.4 v turns-off the out2 and activates the active discharge. 6 in2 inputs pin for second channel. it is recommended to connect 1 f ceramic capacitor close to the device pin. 7 in1 inputs pin for first channel. it is recommended to connect 1 f ceramic capacitor close to the device pin. 8 en1 driving en1 over 0.9 v turns-on out1. driving en below 0.4 v turns-off the out1 and activates the active discharge. ? ep exposed pad must be tied to ground. soldered to the copper plane allows for effective thermal dissipation.
ncp154 http://onsemi.com 3 table 2. absolute maximum ratings rating symbol value unit input voltage (note 1) v in1 , v in2 ?0.3 v to 6 v v output voltage v out1 , v out2 ?0.3 v to v in + 0.3 v or 6 v v enable inputs v en1 , v en2 ?0.3 v to v in + 0.3 v or 6 v v output short circuit duration t sc indefinite s maximum junction temperature t j(max) 150 c storage temperature t stg ?55 to 150 c esd capability, human body model (note 2) esd hbm 2,000 v esd capability, machine model (note 2) esd mm 200 v stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. refer to electrical characteristis and application information for safe operating area. 2. this device series incorporates esd protection and is tested by the following methods: esd human body model tested per aec?q100?002 (eia/jesd22?a114) esd machine model tested per aec?q100?003 (eia/jesd22?a115) latchup current maximum rating tested per jedec standard: jesd78. table 3. thermal characteristics (note 3) rating symbol value unit thermal characteristics, xdfn8 1.2 1.6 mm, thermal resistance, junction-to-air ja 160 c/w 3. single component mounted on 1 oz, fr4 pcb with 645 mm 2 cu area.
ncp154 http://onsemi.com 4 table 4. electrical characteristics (?40 c t j 85 c; v in =v out(nom) + 1 v or 2.5 v, whichever is greater; v en = 0.9 v, i out = 1 ma, c in =c out =1 f. typical values are at t j = +25 c. min/max values are specified for t j = ?40 c and t j =85 c respectively.) (note 4) parameter test conditions symbol min typ max unit operating input voltage v in 1.9 5.25 v output voltage accuracy ?40 c t j 85 c v out > 2 v v out ?2 +2 % v out 2 v ?60 +60 mv line regulation v out + 0.5 v v in 5 v reg line 0.02 0.1 %/v load regulation i out = 1 ma to 300 ma reg load 15 40 mv dropout voltage (note 5) i out = 300 ma v out(nom) = 1.5 v v do 360 470 mv v out(nom) = 1.8 v 335 390 mv v out(nom) = 2.7 v 165 275 mv v out(nom) = 2.8 v 160 270 mv v out(nom) = 3.0 v 150 260 mv v out(nom) = 3.3 v 140 250 mv output current limit v out = 90% v out(nom) i cl 400 ma quiescent current i out = 0 ma, en1=v in , en2=0v or en2=v in , en1=0v i q 55 100 a i out1 = i out2 = 0 ma, v en1 = v en2 = v in i q 110 200 a shutdown current (note 6) v en 0.4 v, v in = 5.25 v i dis 0.1 1 a en pin threshold voltage high threshold low threshold v en voltage increasing v en voltage decreasing v en_hi v en_lo 0.9 0.4 v en pin input current v en = v in = 5.25 v i en 0.3 1.0 a power supply rejection ratio v in = v out+ 1 v for v out > 2 v, v in = 2.5 v, for v out 2 v, i out = 10 ma f = 1 khz psrr 75 db output noise voltage f = 10 hz to 100 khz v n 75 v rms active discharge resistance v in = 4 v, v en < 0.4 v r dis 50 thermal shutdown temperature temperature increasing from t j = +25 c t sd 160 c thermal shutdown hysteresis temperature falling from t sd t sdh ? 20 ? c product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 4. performance guaranteed over the indicated operating temperature range by design and/ or characterization. production tested at t j =t a =25 c. low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible . 5. characterized when v out falls 100 mv below the regulated voltage at v in =v out(nom) +1v. 6. shutdown current is the current flowing into the in pin when the device is in the disable state.
ncp154 http://onsemi.com 5 typical characteristics figure 3. output voltage vs. temperature ? v out = 1.0 v figure 4. output voltage vs. temperature ? v out = 1.0 v t j , junction temperature ( c) t j , junction temperature ( c) 80 50 35 20 5 ?10 ?25 ?40 0.95 0.96 0.98 0.99 1.00 1.02 1.04 1.05 80 65 35 20 5 ?10 ?25 ?40 1.75 1.76 1.78 1.79 1.80 1.81 1.83 1.85 figure 5. output voltage vs. temperature ? v out = 1.0 v figure 6. output voltage vs. temperature ? v out = 1.0 v t j , junction temperature ( c) t j , junction temperature ( c) 80 65 35 20 5 ?10 ?25 ?40 2.75 2.76 2.78 2.79 2.80 2.82 2.83 2.85 80 65 50 20 5 ?10 ?25 ?40 3.25 3.26 3.28 3.29 3.31 3.32 3.33 3.35 figure 7. ground current vs. output current figure 8. quiescent current vs. input voltage i out , output current (ma) v in , input voltage (v) 270 210 150 120 90 60 30 0 0 60 120 240 360 420 540 600 5.0 4.0 3.5 3.0 2.0 1.0 0.5 0 0 6 18 24 36 42 54 60 v out , output voltage (v) v out , output voltage (v) v out , output voltage (v) v out , output voltage (v) i gnd , ground current ( a) i q , quiescent current ( a) 65 95 0.97 1.01 1.03 i out = 1 ma i out = 300 ma i out = 1 ma i out = 300 ma 50 95 1.77 1.82 1.84 i out = 1 ma i out = 300 ma i out = 1 ma i out = 300 ma v in = 2.5 v v out = 1.0 v c in = c out = 1 f 50 95 2.77 2.81 2.84 35 95 3.27 3.30 3.34 v in = 2.8 v v out = 1.8 v c in = c out = 1 f v in = 3.8 v v out = 2.8 v c in = c out = 1 f v in = 4.3 v v out = 3.3 v c in = c out = 1 f 180 300 480 180 240 300 v in = 4.3 v v out = 3.3 v c in = c out = 1 f t j = 85 c t j = 25 c t j = ?40 c 12 30 48 1.5 2.5 4.5 5.5 85 c ?40 c 25 c v in = 4.3 v v out = 3.3 v c in = c out = 1 f
ncp154 http://onsemi.com 6 typical characteristics figure 9. quiescent current vs. temperature figure 10. line regulation vs. temperature ? v out = 1.0 v t j , junction temperature ( c) t j , junction temperature ( c) 80 65 50 35 5 ?10 ?25 ?40 40 42 46 48 52 54 58 60 95 65 50 20 5 ?10 ?25 ?40 ?0.10 ?0.08 ?0.04 0.06 0 0.04 0.08 0.10 figure 11. line regulation vs. temperature ? v out = 3.3 v figure 12. load regulation vs. temperature ? v out = 1.0 v t j , junction temperature ( c) t j , junction temperature ( c) 80 65 50 35 5 ?10 ?25 ?40 ?0.10 0.06 ?0.04 ?0.02 0.02 0.04 0.08 0.10 80 65 50 20 5 ?10 ?25 ?40 0 3 9 12 15 21 27 30 figure 13. load regulation vs. temperature ? v out = 3.3 v figure 14. dropout voltage vs. output current ? v out = 3.3 v t j , junction temperature ( c) i out , output current (ma) 95 65 35 20 5 ?10 ?25 ?40 0 3 9 12 18 21 27 30 275 225 175 125 100 75 50 0 0 25 50 75 125 150 175 200 i q , quiescent current ( a) line reg , line regulation (%/v) line reg , line regulation (%/v) reg load , load regulation (mv) reg load , load regulation (mv) v drop , dropout voltage (mv) v in = 4.3 v v out = 3.3 v c in = c out = 1 f 44 50 56 20 95 35 80 ?0.06 ?0.02 0.02 v in = 2.5 v v out = 1.0 v c in = c out = 1 f 20 95 ?0.08 ?0.06 0 v in = 4.3 v v out = 3.3 v c in = c out = 1 f v in = 2.5 v v out = 1.0 v c in = c out = 1 f 6 18 24 35 95 50 80 6 15 24 v in = 4.3 v v out = 3.3 v c in = c out = 1 f 25 150 200 250 300 100 v in = 4.3 v v out = 3.3 v c in = c out = 1 f t j = 85 c t j = 25 c t j = ?40 c
ncp154 http://onsemi.com 7 typical characteristics figure 15. dropout voltage vs. temperature figure 16. dropout voltage vs. output voltage t j , junction temperature ( c) v out , output voltage (v) 95 65 50 20 5 ?10 ?25 ?40 0 20 40 80 100 120 180 200 3.3 3.1 2.7 2.5 2.3 2.1 1.7 1.5 0 50 100 150 200 300 350 400 figure 17. current limit vs. temperature figure 18. short circuit current vs. temperature t j , junction temperature ( c) t j , junction temperature ( c) 80 65 50 20 5 ?10 ?25 ?40 350 375 425 450 500 525 575 600 95 80 50 20 5 ?10 ?25 ?40 350 375 400 450 500 525 575 600 figure 19. short circuit current vs. input voltage figure 20. disable current vs. temperature v in , input voltage (v) t j , junction temperature ( c) 5.2 4.9 4.3 4.0 3.7 3.1 2.8 2.5 430 440 460 470 490 500 520 530 95 80 50 35 20 5 ?25 ?40 0 3 9 12 18 21 24 30 v drop , dropout voltage (mv) v do , dropout voltage (mv) i cl , current limit (ma) i sc , short circuit current (ma) i sc , short circuit current (ma) i dis , disable current (na) v in = 4.3 v v out = 3.3 v c in = c out = 1 f i out = 300 ma 60 140 160 250 1.9 2.9 3.5 35 80 35 95 400 475 550 v out = 90% v out(nom) c in = c out = 1 f v in = 3.8 v v in = 5.25 v 65 35 425 475 550 v out = 0 v c in = c out = 1 f v in = 3.8 v v in = 5.25 v 65 ?10 6 15 27 v in = 4.3 v v out = 0 v v en = 0 v c in = c out = 1 f 3.4 4.6 5.5 450 480 510 v out = 0 v c in = c out = 1 f i out = 150 ma i out = 0 ma
ncp154 http://onsemi.com 8 typical characteristics figure 21. enable thresholds vs. temperature figure 22. current to enable pin vs. temperature t j , junction temperature ( c) t j , junction temperature ( c) 80 65 35 20 5 ?10 ?25 ?40 0 0.1 0.3 0.4 0.5 0.7 0.8 1.0 80 65 50 20 5 ?10 ?25 ?40 0 50 150 200 250 300 400 450 figure 23. discharge resistivity vs. temperature figure 24. power supply rejection ratio, v out = 1.0 v t j , junction temperature ( c) frequency (khz) 80 65 50 20 5 ?10 ?25 ?40 0 10 20 40 60 70 90 100 10,000 1,000 100 10 1 0.1 0 10 30 40 60 70 80 100 figure 25. power supply rejection ratio, v out = 3.3 v figure 26. output capacitor esr vs. output current frequency (khz) i out , output current (ma) 10,000 1,000 100 10 1 0.1 0 10 30 40 50 70 90 100 270 210 180 150 120 60 30 0 0.1 1 10 100 v en , enable voltage (v) i en , enable current (na) r dis , discharge resistivity ( ) rr, ripple rejection (db) rr, ripple rejection (db) esr ( ) 50 95 0.2 0.6 0.9 off on on off 35 95 100 350 v in = 4.3 v v out = 3.3 v c in = c out = 1 f v in = 4.3 v v out = 3.3 v c in = c out = 1 f 35 95 30 50 80 v in = 4 v v out = 1 v c in = c out = 1 f 20 50 90 300 ma 150 ma 100 ma 1 ma 10 ma v in = 2.5 v + 100 mv pp v out = 1.0 v c in = none c out = 1 f, mlcc 300 ma 150 ma 100 ma 1 ma 10 ma v in = 4.3 v + 100 mv pp v out = 3.3 v c in = none c out = 1 f, mlcc 20 60 80 v out = 1.0 v v out = 3.3 v 90 240 300 v in = v out + 1 v or 2.5 v c in = c out = 1 f, mlcc, size 1206
ncp154 http://onsemi.com 9 typical characteristics figure 27. output voltage noise spectral density for v out = 1.0 v, c out = 1 f frequency (khz) 100 10 1 1000 0.1 0.01 0.001 0.01 0.1 1 10 figure 28. output voltage noise spectral density for v out = 1.8 v, c out = 1 f figure 29. output voltage noise spectral density for v out = 3.3 v, c out = 1 f output voltage noise ( v/sqrthz) i out 10 hz ? 100 khz 100 hz ? 100 khz 1 ma 40.83 40.27 10 ma 36.03 35.38 150 ma 36.54 35.97 300 ma 37.05 36.48 rms output noise ( v) i out 10 hz ? 100 khz 100 hz ? 100 khz 1 ma 77.84 77.28 10 ma 71.71 70.48 150 ma 71.95 70.88 300 ma 72.71 71.67 rms output noise ( v) i out 10 hz ? 100 khz 100 hz ? 100 khz 1 ma 119.7 117.87 10 ma 113.47 111.47 150 ma 113.84 112.05 300 ma 115.95 114.03 rms output noise ( v) 300 ma 150 ma 1 ma 10 ma v in = 2.5 v v out = 1.0 v c in = c out = 1 f frequency (khz) 100 10 1 1000 0.1 0.01 0.001 0.01 0.1 1 10 output voltage noise ( v/sqrthz) 300 ma 150 ma 1 ma 10 ma v in = 2.8 v v out = 1.8 v c in = c out = 1 f frequency (khz) 100 10 1 1000 0.1 0.01 0.001 0.01 0.1 1 10 output voltage noise ( v/sqrthz) 300 ma 150 ma 1 ma 10 ma v in = 4.3 v v out = 3.3 v c in = c out = 1 f
ncp154 http://onsemi.com 10 typical characteristics figure 30. enable turn?on response ? v out = 1.0 v, c out = 1 f figure 31. enable turn?on response ? v out = 1.0 v, c out = 4.7 f 40 s/div 40 s/div 500 mv/div figure 32. enable turn?on response ? v out = 3.3 v, c out = 1 f figure 33. enable turn?on response ? v out = 3.3 v, c out = 4.7 f 40 s/div 40 s/div figure 34. line transient response ? rising edge, v out = 3.3 v, i out = 10 ma figure 35. line transient response ? falling edge, v out = 3.3 v, i out = 10 ma 8 s/div 8 s/div v in = 2.5 v v out = 1.0 v i out = 10 ma c in = c out = 1 f 50 ma/div 500 mv/div 500 mv/div v in = 2.5 v v out = 1.0 v i out = 10 ma c in = c out = 4.7 f 100 ma/div 500 mv/div v en i in v out v en i in v out 1 v/div v in = 4.3 v v out = 3.3 v i out = 10 ma c in = c out = 1 f 100 ma/div 500 mv/div 1 v/div v in = 4.3 v v out = 3.3 v i out = 10 ma c in = c out = 4.7 f 200 ma/div 500 mv/div v en i in v out v en i in v out 20 mv/div 500 mv/div 20 mv/div v in = 4.8 v to 3.8 v i out = 10 ma c in = none c out = 1 f 500 mv/div v in v out v in v out v in = 3.8 v to 4.8 v i out = 10 ma c in = none c out = 1 f t rise = 1 s t fall = 1 s
ncp154 http://onsemi.com 11 typical characteristics figure 36. line transient response? rising edge, v out = 3.3 v, i out = 300 ma figure 37. line transient response? falling edge, v out = 3.3 v, i out = 300 ma 4 s/div 4 s/div figure 38. line transient response? rising edge, v out = 3.3 v, i out = 10 ma, cout = 4.7 f figure 39. line transient response? falling edge, v out = 3.3 v, i out = 10 ma, c out = 4.7 f 4 s/div 4 s/div figure 40. load transient response ? 1.0 v ? rising edge, i out1 = 100 a to 300 ma figure 41. load transient response ? 1.0 v ? falling edge, i out1 = 300 ma to 100 a 4 s/div 100 s/div v in = 3.8 v to 4.8 v i out = 300 ma c in = none c out = 1 f 20 mv/div 500 mv/div 20 mv/div 500 mv/div v in v out v in v out 20 mv/div 500 mv/div 20 mv/div 500 mv/div v in v out v in v out 50 mv/div 100 ma/div v out1 t rise = 1 s v in = 4.8 v to 3.8 v i out = 300 ma c in = none c out = 1 f t fall = 1 s v in = 3.8 v to 4.8 v i out = 10 ma c in = none c out = 4.7 f t rise = 1 s v in = 4.8 v to 3.8 v i out = 10 ma c in = none c out = 4.7 f t fall = 1 s v out2 50 mv/div v in = 2.8 v v out1 = 1.0 v, v out2 = 1.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f t rise = 500 ns 50 mv/div 100 ma/div i out1 v out1 v out2 50 mv/div v in = 2.8 v v out1 = 1.0 v, v out2 = 1.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f t fall = 500 ns i out1
ncp154 http://onsemi.com 12 typical characteristics figure 42. load transient response ? 1.0 v ? rising edge, i out1 = 1 ma to 300 ma figure 43. load transient response ? 1.0 v ? falling edge, i out1 = 300 ma to 1 ma 4 s/div 10 s/div figure 44. load transient response ? 1.0 v ? rising edge, i out1 = 50 ma to 300 ma figure 45. load transient response ? 1.0 v ? falling edge, i out1 = 300 ma to 50 ma 4 s/div 4 s/div figure 46. load transient response ? 3.3 v ? rising edge, i out1 = 100 a to 300 ma figure 47. load transient response ? 3.3 v ? falling edge, i out1 = 300 ma to 100 a 4 s/div 100 s/div 50 mv/div 100 ma/div 50 mv/div 100 ma/div v out2 50 mv/div 100 ma/div v out1 t rise = 500 ns v out2 50 mv/div v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f t rise = 500 ns 50 mv/div 100 ma/div i out1 v out1 v out2 50 mv/div v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f t fall = 500 ns 50 mv/div v out1 i out1 v in = 2.8 v v out1 = 1.0 v, v out2 = 1.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f 50 mv/div v out2 t fall = 500 ns v out1 i out1 v in = 2.8 v v out1 = 1.0 v, v out2 = 1.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f 50 mv/div 100 ma/div v out2 t rise = 500 ns 50 mv/div v out1 i out1 v in = 2.8 v v out1 = 1.0 v, v out2 = 1.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f 50 mv/div 100 ma/div 50 mv/div v out2 t fall = 500 ns v out1 i out1 v in = 2.8 v v out1 = 1.0 v, v out2 = 1.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f i out1
ncp154 http://onsemi.com 13 typical characteristics figure 48. load transient response ? 3.3 v ? rising edge, i out1 = 1 ma to 300 ma figure 49. load transient response ? 3.3 v ? falling edge, i out1 = 300 ma to 1 ma 4 s/div 10 s/div figure 50. load transient response ? 3.3 v ? rising edge, i out1 = 50 ma to 300 ma figure 51. load transient response ? 3.3 v ? falling edge, i out1 = 300 ma to 50 ma 4 s/div 4 s/div figure 52. enable turn?off ? v out = 1.0 v figure 53. enable turn?off ? v out = 3.3 v 200 s/div 200 s/div 50 mv/div 100 ma/div 50 mv/div 100 ma/div v out2 500 mv/div v out t rise = 500 ns 500 mv/div v in = 4.3 v v out = 3.3 v i out = 0 ma c out = 1 f, 4.7 f t rise = 500 ns 50 mv/div v out1 i out1 v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f 50 mv/div v out2 t fall = 500 ns v out1 i out1 v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f 50 mv/div 100 ma/div v out2 t rise = 500 ns 50 mv/div v out1 i out1 v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f 50 mv/div 100 ma/div 50 mv/div v out2 t fall = 500 ns v out1 i out1 v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out2 = 10 ma c out1 = 1 f, c out2 = 1 f v en c out = 1 f c out = 4.7 f 500 mv/div v out 1 v/div v in = 4.3 v v out = 3.3 v i out = 0 ma c out = 1 f, 4.7 f t rise = 500 ns v en c out = 1 f c out = 4.7 f
ncp154 http://onsemi.com 14 typical characteristics figure 54. turn?on/off ? slow rising v in figure 55. short circuit and thermal shutdown 20 ms/div 4 ms/div 1 v/div v out1 v out2 v in v in = 4.3 v v out1 = 3.3 v, v out2 = 2.8 v i out1 = 10 ma, i out2 = 10 ma c in = c out1 = c out2 = 1 f 1 v/div i out 500 ma/div v out tsd cycling thermal shutdown short circuit current short circuit event overheating v in = 5.25 v v out = 3.3 v c in = c out = 1 f
ncp154 http://onsemi.com 15 general the ncp154 is a dual output high performance 300 ma low dropout linear regulator. this device delivers very high psrr (75 db at 1 khz) and excellent dynamic performance as load/line transients. in connection with low quiescent current this device is very suitable for various battery powered applications such as tablets, cellular phones, wireless and many others. each output is fully protected in case of output overload, output short circuit condition and overheating, assuring a very robust design. the ncp154 device is housed in xdfn?8 1.6 mm x 1.2 mm package which is useful for space constrains application. input capacitor selection (c in ) it is recommended to connect at least a 1 f ceramic x5r or x7r capacitor as close as possible to the in pin of the device. this capacitor will provide a low impedance path for unwanted ac signals or noise modulated onto constant input voltage. there is no requirement for the min. or max. esr of the input capacitor but it is recommended to use ceramic capacitors for their low esr and esl. a good input capacitor will limit the influence of input trace inductance and source resistance during sudden load current changes. larger input capacitor may be necessary if fast and large load transients are encountered in the application. output decoupling (c out ) the ncp154 requires an output capacitor for each output connected as close as possible to the output pin of the regulator. the recommended capacitor value is 1 f and x7r or x5r dielectric due to its low capacitance variations over the specified temperature range. the ncp154 is designed to remain stable with minimum effective capacitance of 0.33 f to account for changes with temperature, dc bias and package s ize. especially for small package size capacitors such as 0201 the effective capacitance drops rapidly with the applied dc bias. there is no requirement for the minimum value of equivalent series resistance (esr) for the c out but the maximum value of esr should be less than 3 . larger output capacitors and lower esr could improve the load transient response or high frequency psrr. it is not recommended to use tantalum capacitors on the output due to their large esr. the equivalent series resistance of tantalum capacitors is also strongly dependent on the temperature, increasing at low temperature. enable operation the ncp154 uses the dedicated en pin for each output channel. this feature allows driving outputs separately. if the en pin voltage is <0.4 v the device is guaranteed to be disabled. the pass transistor is turned?off so that there is virtually no current flow between the in and out. the active discharge transistor is active so that the output voltage v out is pulled to gnd through a 50 resistor. in the disable state the device consumes as low as typ. 10 na from the v in . if the en pin voltage >0.9 v the device is guaranteed to be enabled. the ncp154 regulates the output voltage and the active discharge transistor is turned?off. the both en pin has internal pull?down current source with typ. value of 300 na which assures that the device is turned?off when the en pin is not connected. in the case where the en function isn?t required the en should be tied directly to in. output current limit output current is internally limited within the ic to a typical 400 ma. the ncp154 will source this amount of current measured with a voltage drops on the 90% of the nominal v out . if the output voltage is directly shorted to ground (v out = 0 v), the short circuit protection will limit the output current to 520 ma (typ). the current limit and short circuit protection will work properly over whole temperature range and also input voltage range. there is no limitation for the short circuit duration. this protection works separately for each channel. short circuit on the one channel do not influence second channel which will work according to specification. thermal shutdown when the die temperature exceeds the thermal shutdown threshold (t sd ? 160 c typical), thermal shutdown event is detected and the affected channel is turn?off. second channel still working. the channel which is overheated will remain in this state until the die temperature decreases below the thermal shutdown reset threshold (t sdu ? 140 c typical). once the device temperature falls below the 140 c the appropriate channel is enabled again. the thermal shutdown feature provides the protection from a catastrophic device failure due to accidental overheating. this protection is not intended to be used as a substitute for proper heat sinking. the long duration of the short circuit condition to some output channel could cause turn?off other output when heat sinking is not enough and temperature of the other output reach t sd temperature. power dissipation as power dissipated in the ncp154 increases, it might become necessary to provide some thermal relief. the maximum power dissipation supported by the device is dependent upon board design and layout. mounting pad configuration on the pcb, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. the maximum power dissipation the ncp154 can handle is given by: p d(max) 125 o c t a ja (eq. 1) the power dissipated by the ncp154 for given application conditions can be calculated from the following equations: p d v in1 i gnd1
v in2 i gnd2
(eq. 2)
i out1 v in1 v out1
i out2 v in2 v out2
ncp154 http://onsemi.com 16 figure 56. ja vs. copper area (xdfn-8) copper heat spreader area (mm 2 ) 500 700 400 300 200 600 100 0 60 80 100 120 140 180 200 220 ja , junction to ambient ther- mal resistance ( c/w) 0.25 0.50 0.75 1.00 p d(max) , maximum power dissipation (w) 160 240 p d(max) , t a = 25 c, 2 oz cu p d(max) , t a = 25 c, 1 oz cu ja , 1 oz cu ja , 2 oz cu reverse current the pmos pass transistor has an inherent body diode which will be forward biased in the case that v out > v in . due to this fact in cases, where the extended reverse current condition can be anticipated the device may require additional external protection. power supply rejection ratio the ncp154 features very good power supply rejection ratio. if desired the psrr at higher frequencies in the range 100 khz ? 10 mhz can be tuned by the selection of c out capacitor and proper pcb layout. turn?on time the turn?on time is defined as the time period from en assertion to the point in which v out will reach 98% of its nominal value. this time is dependent on various application conditions such as v out(nom) , c out , t a . pcb layout recommendations to obtain good transient performance and good regulation characteristics place input and output capacitors close to the device pins and make the pcb traces wide. in order to minimize the solution size, use 0402 capacitors. larger copper area connected to the pins will also improve the device thermal resistance. the actual power dissipation can be calculated from the equation above (equation 2). expose pad should be tied the shortest path to the gnd pin.
ncp154 http://onsemi.com 17 table 5. ordering information device voltage option* (out1/out2) marking package shipping ? ncp154mx280280tag 2.8 v / 2.8 v da xdfn?8 (pb-free) 3000 / tape & reel ncp154mx180280tag 1.8 v / 2.8 v dc ncp154mx330180tag 3.3 v / 1.8 v dd ncp154mx300180tag 3.0 v / 1.8 v de ncp154mx330280tag 3.3 v / 2.8 v df ncp154mx330330tag 3.3 v / 3.3 v dg ncp154mx330300tag 3.3 v / 3.0 v dh ncp154mx300300tag 3.0 v / 3.0 v dj ncp154mx100180tag 1.0 v / 1.8 v dk NCP154MX150280TAG 1.5 v / 2.8 v dl ncp154mx180290tag 1.8 v / 2.9 v dm ncp154mx180300tag 1.8 v / 3.0 v dn ncp154mx280270tag 2.8 v / 2.7 v dp ncp154mx310310tag 3.1 v / 3.1 v dq ncp154mx330285tag 3.3 v / 2.85 v dr ncp154mx180270tag 1.8 v / 2.7 v dt ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *contact factory for other voltage options. output voltage range 1.0 v to 3.3 v with step 50 mv.
ncp154 http://onsemi.com 18 package dimensions xdfn8 1.6x1.2, 0.4p case 711as issue a notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to the exposed pad as well as the terminals. a seating plane 0.10 c a1 2x 2x 0.10 c dim a min max millimeters 0.30 0.45 a1 0.00 0.05 b 0.13 0.23 d e l1 d2 pin one identifier 0.08 c 0.10 c a 0.10 c e b b 4 8 8x 1 5 0.05 c mounting footprint* e2 1.60 bsc 1.20 bsc 0.05 ref 1.20 1.40 0.20 0.40 bottom view l 8x dimensions: millimeters 0.35 8x 0.26 8x 1.40 0.40 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. note 3 l 0.15 0.25 top view b side view recommended 0.44 a d e 8x e/2 e2 d2 1.44 package outline 1 detail b c detail a l1 detail a optional construction l ?? ?? 0.40 bsc 8x l1 8x on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ncp154/d bluetooth is a registered trademark of bluetooth sig. zigbee is a registered trademark of zigbee alliance. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative

▲Up To Search▲

Price & Availability of NCP154MX150280TAG

	To Download NCP154MX150280TAG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .